| Procedure | Responsible Unit | Procedure | Responsible Unit |
| Customer Response | Issue Corrective Action Report to Customer | Sales& Marketing Dept. | |
| Issue Report | Sales& Marketing Dept. | File | |
| Defect Analysis | QC& Engineering Dept. | ||
| Discussion Meeting | Engineering Sales& Marketing QA Production | ||
| Amendment Report | QA Dept. |
| Project | Test Standards | Test Conditions | Requirement |
| Solderability | ANSI / J-STD-003 TEST | Immerse in a tin furnace with a temperature of 265±5℃ for 3-5 seconds | Pad wetting is more than 95% |
| Copper Thickness Test | Metal Slice Analysis | OLYMPUS Metallographic Microscope | According to customer requirements |
| Impedance Test | Impedance Bar | Tektronix Impedance Tester | Meet customer impedance requirements |
| Thermal Shock Test | IPC-TM-650 2.6.8 | Immerse in a tin furnace with a temperature of 288±5℃ for 10 seconds, 3 times | No delamination and blistering |
| Ionic Contamination Test | IPC-TM-650 2.3.26 | The solution concentration is 75% | 10.6ug/sqin |
| Peel Strength Test | IPC-TM-650 2.4.8.4 | Peeling speed: 50mm/min | 1/2OZ:≥6ib/in 1/1OZ:≥8ib/in 2/2OZ:≥11ib/in |
| Adhesion Test | IPC-TM-650 2.4.28.1 | 3M600# tape, length 50mm | No coating and ink peeling |
