| Project | Processing Capability | Detailed Explanation |
| Number of layers | 1-6 layer PCB circuit board | The number of pcb layers refers to the number of Production of 1-6 through-hole plates |
| sheet type | FR-4 rigid board/aluminum base plate | FR-4 board (A-level Kingboard material, A-level National materials)/aluminum base plate {halogen-free circuit board} |
| Ink | Guangxin/Hongda/Lanbang | The quality of the ink directly affects the solder mask performance of the PCB. This directly affects the performance of the product |
| Maximum specifications | 680mm*680mm | Maximum specification for double-sided pcb board production: 680x680mm, four or six layers The largest specification for pcb board production: 680x680mm |
| Board thickness range | 0.4–3.0mm | Currently customized PCB thickness: 0.4/0.6/0.8/ 1.0/1.2/1.6/2.0–3.0mm |
| Dimensional accuracy | ±0.13mm | CNC outline tolerance±0.13mm, V-cut board outline Tolerance ±0.1mm |
| Board thickness tolerance (t≥1.0mm) | ± 10% | Please note this item: due to production process reasons (copper, Solder mask and pad spraying will increase the thickness of the board) Generally go positive tolerance |
| Board thickness tolerance (t<1.0mm) | ±0.1mm | Please note this item: due to production process reasons (copper, Solder mask and pad spraying will increase the thickness of the board) Generally go positive tolerance |
| Minimum line width and line moment | 4mil/4mil（0.1mm） | At present, 4mil line width and line moment and line width line can be customized Moment is as large as possible to be greater than 4mil |
| minimum aperture | 0.3mm | At present, 0.3mm line width and line moment and line width can be customized The line moment should be as large as 0.3mm |
| Minimum clearance | 4mil（0.1mm） | Currently, 4mil line spacing can be produced, and the gap should be greater than 4mil as much as possible< /td> |
| finished outer copper thickness | 35um/70um/105um（1 OZ/2 OZ/3 OZ） | refers to the thickness of the outer circuit copper foil of the finished circuit board, 1 OZ=35um, 2 OZ=70um, 3 OZ=105um |
| finished hole diameter (machine drill) | 0.3–6.0mm | Because of the metal copper attached to the inner wall of the hole, the diameter of the finished hole is generally smaller than Drill hole diameter in the file |
| Aperture tolerance (machine drill) | ±0.075mm | The tolerance of drilling is ±0.075mm, for example, the design is 0.6mm hole, the finished hole diameter of the physical board is 0.525-0.675mm is qualified and allowed |
| Solder mask color | Green/Red/Blue/White/Black/Purple | The solder mask color refers to the ink color of the solder mask on the surface of the pcb |
| Minimum character width | ≥0.15mm | The minimum width of the character, if it is less than 0.15mm, the physical board may Characters will be unclear due to design reasons |
| Minimum character height | ≥0.8mm | The minimum height of the character, if it is less than 0.8mm, the physical board may Characters will be unclear due to design reasons |
| Character aspect ratio | 01:05 | The most suitable aspect ratio is more conducive to production |
| Spacing between trace and outline | ≥0.3mm（12mil） | Gong board shipment, the line layer is routed away from the board outline line The distance between the V-cut and the center line of the V-cut is not less than 0.3mm; the distance between the trace and the center line of the V-cut must not be less than 0.4mm |
| Imposition: No gaps to imposition gaps | 0 | is an imposition shipment, the gap between the middle board and the board is 0 (The document has detailed explanation) |
| Imposition: there is a gap imposition gap | 1.6mm | The gap between the imposition should not be less than 1.6mm, otherwise the gong edge Time is more difficult |
| pcb shape process edge | 0.3mm/0.5mm | The conventional process edge is 0.5mm, if there are special requirements, please advance Inform |
| Pads factory copper laying method | Hatch method of copper laying | The manufacturer uses restore copper paving, this item is designed with pads Customers must pay attention |
| Pads in the painting slot | Use Drill Drawing layer | If there are more non-metallic grooves on the board, please draw On the Drill Drawing layer |
| Protel/dxp software window layer | Solder layer | A few engineers mistakenly placed the paste layer. Do the processing |
| Half hole process | the number does not exceed 10 | The half hole process is a special process, and the minimum hole diameter should not be less than 1.0mm |
| Via single-side solder ring (t<1.0mm) | 4mil｛0.1mm｝ | The parameter is the minimum value, try to be larger than this parameter |
| Minimum via inner diameter/outer diameter | Inner diameter 0.2mm, outer diameter 0.45mm | The minimum inner diameter of the double panel is 0.3mm, the minimum outer diameter is 0.6mm, The minimum inner diameter of the multilayer board is 0.2mm, and the minimum outer diameter is 0.45mm |
Layers | Template | Multitudinous |
Double-sided board | 3~4 working days | 7~10 working days |
Four layers board | 7~8 working days | 12~14 working days |
Six layers board | 8~10 working days | 14~16 working days |
Eight layers board | 10~12 working days | 15~18 working days |